Input sensing circuit and display module having the same

ABSTRACT

A display module includes: a display panel; and an input sensing circuit disposed thereon, the input sensing circuit including: a first sensor group including a plurality of first sensors arranged in a first direction; a plurality of first connection portions electrically connecting two adjacent first sensors of the plurality of first sensors, respectively; a second sensor group including a plurality of second sensors arranged in a second direction crossing the first direction; a plurality of second connection portions electrically connecting two adjacent second sensors of the plurality of second sensors, respectively; a first signal line electrically connected to one first sensor of the plurality of first sensors; a first measuring line electrically connected to the one first sensor among the plurality of first sensors and spaced apart from the first signal line; and a second measuring line electrically connected to another first sensor among the plurality of first sensors.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2018-0140141, filed on Nov. 14, 2018, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments/implementations of the invention relate generallyto an input sensing circuit that senses a user's touch and a pressureapplied thereto and a display module having the input sensing circuit.

Discussion of the Background

Various display devices, which are applied to a multimedia device, suchas a television set, a mobile phone, a tablet computer, a navigationunit, and a game unit, have been developed. The display devices includea keyboard or a mouse as their input device.

In recent years, the display devices have included an input sensingcircuit as their input device to sense a user's touch or a pressureapplied thereto from the user.

The display devices recognize a user's finger that makes contact with ascreen thereof through the input sensing circuit. The input sensingcircuit senses the user's touch by using various methods, such as aresistive overlay method, an optical overlay method, a capacitiveoverlay method, or an ultrasonic method. Among them, the capacitiveoverlay method detects whether the user's touch occurs using acapacitance that varies when a touch generating member makes contactwith the screen of the display device.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Devices constructed according to exemplary implementations of theinvention provide an input sensing circuit capable of sensing a user'stouch and a pressure applied thereto, and a display module including theinput sensing circuit.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to one or more exemplary embodiments of the invention, adisplay module including a display panel and an input sensing circuitdisposed on the display panel. The input sensing circuit includes afirst sensor group including a plurality of first sensors arranged in afirst direction, a plurality of first connection portions electricallyconnecting two adjacent first sensors of the plurality of first sensors,respectively, a second sensor group including a plurality of secondsensors arranged in a second direction crossing the first direction, aplurality of second connection portions electrically connecting twoadjacent second sensors of the plurality of second sensors,respectively, a first signal line electrically connected to one firstsensor of the plurality of first sensors, a first measuring lineelectrically connected to the one first sensor among the plurality offirst sensors and spaced apart from the first signal line, and a secondmeasuring line electrically connected to another first sensor among theplurality of first sensors.

The one first sensor among the plurality of first sensors may include abody portion, a first junction portion protruded from the body portionin a direction substantially parallel to the first direction andconnected to the first signal line, and a second junction portionprotruded from the body portion in the direction substantially parallelto the first direction and connected to the first measuring line.

A first length of the first junction portion in the first direction maybe different from a second length of the second junction portion in thefirst direction. The second length may be longer than the first length.

A third length of the first junction portion in the second direction maybe equal to or greater than a fourth length of the second junctionportion in the second direction and equal to or smaller than four timesthe fourth length.

The input sensing circuit may further include an insulating layer thatcovers the plurality of first sensors, the plurality of second sensors,and the first connection portions. At least a portion of each of thesecond connection portions may be disposed on the insulating layer. Theone first sensor of the plurality of first sensors may include a bodyportion and a first junction portion protruded from the body portion inthe first direction and connected to the first signal line.

The input sensing circuit may further include a second junction portiondisposed on the insulating layer, overlapped with the first junctionportion, and connected to the one first sensor of the plurality of firstsensors and the first measuring line.

A plurality of first contact holes and a second contact hole may bedefined through the insulating layer, the second connection portions maybe connected to the plurality of second sensors through the firstcontact holes, and the second junction portion may be connected to theone first sensor of the plurality of first sensors through the secondcontact hole.

The input sensing circuit further may include a second signal lineelectrically connected to one second sensor among the plurality ofsecond sensors.

The input sensing circuit may further include an input sensing driverelectrically connected to the first signal line, the second signal line,the first measuring line, and the second measuring line.

The input sensing driver may be configured to sense a resistance changevalue of the first measuring line, the plurality of first sensors, andthe second measuring line during a first period.

The input sensing driver may be configured to sense a capacitance valueformed by the plurality of first sensors and the plurality of secondsensors during a second period, the second period being different fromthe first period.

The first sensor group may include a plurality of the first sensorgroups, and the input sensing driver may be configured to compare aresistance change value of one first sensor group among the plurality offirst sensor groups with a resistance change value of another firstsensor group among the plurality of first sensor groups, the one firstsensor group and the another first sensor group being adjacent to eachother.

The display module may further include an adhesive member disposedbetween the display panel and the input sensing circuit, the adhesivemember having a predetermined elasticity.

The one first sensor among the plurality of first sensors may bedisposed at one distal end of the first sensor group in the firstdirection, and the another first sensor among the plurality of firstsensors may be disposed at an opposing distal end of the first sensorgroup in the first direction.

According to one or more exemplary embodiments of the invention, aninput sensing circuit includes a base layer, a plurality of plurality offirst sensors, a plurality of first connection portions, a plurality ofplurality of second sensors, a plurality of second connection portions,a first signal line, a first measuring line, and a second measuringline. The plurality of first sensors are disposed on the base layer andarranged in a first direction. The first connection portions aredisposed on the base layer, and each of the first connection portionselectrically connects two adjacent first sensors of the plurality offirst sensors, respectively. The plurality of second sensors aredisposed on the base layer and arranged in a second direction crossingthe first direction. The insulating layer is disposed on the base layer,covers the plurality of first sensors, the first connection portions,and the plurality of second sensors, the insulating layer including aplurality of contact holes defined therethrough. The plurality of secondconnection portions are disposed on the insulating layer, andelectrically connecting two plurality of second sensors of the pluralityof second sensors through at least one of the contact holes,respectively. The first signal line may be disposed on the base layerand electrically connected to one first sensor of the plurality of firstsensors. The first measuring line is disposed on the base layer andelectrically connected to the one first sensor among the plurality offirst sensors. The second measuring line is disposed on the base layerand electrically connected to another first sensor among the pluralityof first sensors.

The one first sensor among the plurality of first sensors may include: abody portion; a first junction portion protruded from the body portionin a direction substantially parallel to the first direction andconnected to the first signal line; and a second junction portionprotruded from the body portion in the direction substantially parallelto the first direction and connected to the first measuring line.

A first length of the first junction portion in the first direction maybe smaller than a second length of the second junction portion in thefirst direction.

A third length of the first junction portion in the second direction maybe equal to or greater than a fourth length of the second junctionportion in the second direction and equal to or smaller than four timesthe fourth length.

The one first sensor among the plurality of first sensors may include abody portion and a first junction portion protruded from the bodyportion in a direction substantially parallel to the first direction andconnected to the first signal line.

The input sensing circuit may further include a second junction portiondisposed on the insulating layer, overlapped with the first junctionportion, connected to the one first sensor among the plurality of firstsensors through other contact holes of the contact holes, and connectedto the first measuring line.

The input sensing circuit may further include a second signal linedisposed on the base layer and electrically connected to one secondsensor among the plurality of second sensors.

The input sensing circuit may further include an input sensing driverelectrically connected to the first signal line, the second signal line,the first measuring line, and the second measuring line.

The input sensing driver may be configured to sense a resistance changevalue of the first measuring line, the plurality of first sensors, andthe second measuring line during a first period.

The input sensing driver may be configured to sense a capacitance valueformed by the plurality of first sensors and the plurality of secondsensors during a second period different from the first period.

The first sensor group may include a plurality of the first sensorgroups, and the input sensing driver is configured to compare aresistance change value of one first sensor group among the plurality offirst sensor groups with a resistance change value of another firstsensor group among the plurality of first sensor groups, the one firstsensor group and the another first sensor group being adjacent to eachother.

According to the above, the display device may include the input sensingcircuit that may be configured to sense the user's touch and thepressure applied thereto.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a perspective view showing a display device according to anexemplary embodiment of the present disclosure.

FIGS. 2A, 2B, 2C, and 2D are cross-sectional views showing a displaydevice according to an exemplary embodiment of the present disclosure.

FIG. 3 is a plan view showing a display panel according to an exemplaryembodiment of the present disclosure.

FIG. 4 is an equivalent circuit diagram showing a pixel according to anexemplary embodiment of the present disclosure.

FIG. 5 is a waveform diagram showing signals applied to the pixel ofFIG. 4.

FIG. 6 is a cross-sectional view showing a portion of a pixel accordingto an exemplary embodiment of the present disclosure.

FIG. 7A is a plan view showing an input sensing circuit according to anexemplary embodiment of the present disclosure.

FIG. 7B is an enlarged plan view showing a portion AA of FIG. 7A.

FIG. 7C is an enlarged plan view showing a portion BB of FIG. 7A.

FIG. 8A is a cross-sectional view taken along a sectional line I-I′ ofFIG. 7C.

FIG. 8B is a cross-sectional view taken along a sectional line II-IF ofFIG. 7C.

FIG. 9 is an enlarged plan view showing a portion EE of FIG. 7A.

FIG. 10 is an enlarged plan view showing a portion FF of FIG. 7A.

FIG. 11 is an enlarged plan view showing another example of a portion EEof FIG. 7A.

FIG. 12A is an enlarged plan view showing another example of a portionEE of FIG. 7A.

FIG. 12B is a cross-sectional view taken along a sectional line of FIG.12A.

FIG. 13 is a plan view showing an input sensing circuit according to anexemplary embodiment of the present disclosure.

FIG. 14 is a plan view showing an input sensing circuit according to anexemplary embodiment of the present disclosure.

FIG. 15 is an enlarged plan view showing a portion EE-1 of FIG. 14.

FIG. 16 is an enlarged plan view showing a portion FF-1 of FIG. 14.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, such as the x, y, and z-axes, and may beinterpreted in a broader sense. For example, the DR1-axis, the DR2-axis,and the DR3-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. For thepurposes of this disclosure, “at least one of X, Y, and Z” and “at leastone selected from the group consisting of X, Y, and Z” may be construedas X only, Y only, Z only, or any combination of two or more of X, Y,and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

As is customary in the field, some exemplary embodiments are describedand illustrated in the accompanying drawings in terms of functionalblocks, units, and/or modules. Those skilled in the art will appreciatethat these blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the scope of the inventive concepts. Further, theblocks, units, and/or modules of some exemplary embodiments may bephysically combined into more complex blocks, units, and/or moduleswithout departing from the scope of the inventive concepts.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, the present invention will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a perspective view showing a display device DD according to anexemplary embodiment of the present disclosure.

FIG. 1 shows a smartphone as the display device DD, however, the displaydevice DD should not be limited to the smartphone. That is, the displaydevice DD may be a large-sized electronic item, such as a television setor a monitor, or a small and medium-sized electronic item, such as amobile phone, a tablet computer, a car navigation unit, a game unit, ora smart watch.

The display device DD includes a display area DA and a non-display areaNDA, which are defined therein.

The display area DA through which an image IM is displayed may besubstantially parallel to a surface defined by a first directional axisDR1 and a second directional axis DR2, however, it should not be limitedthereto or thereby. At least a portion of the display area DA may have adome shape on the surface defined by the first directional axis DR1 andthe second directional axis DR2.

A third directional axis DR3 indicates a normal line direction of thedisplay area DA, i.e., a thickness direction of the electronic deviceDD. Front (or upper) and rear (or lower) surfaces of each member of thedisplay device DD are distinguished from each other by the thirddirectional axis DR3. However, directions indicated by the first,second, and third directional axes DR1, DR2, and DR3 may be relative toeach other and may be changed to other directions. Hereinafter, first,second, and third directions respectively correspond to directionsindicated by the first, second, and third directional axes DR1, DR2, andDR3 and are assigned with the same reference numerals as the first,second, and third directional axes DR1, DR2, and DR3.

The shape of the display area DA shown in FIG. 1 is merely exemplary,and the shape of the display area DA may be varied without limitation,as needed.

The non-display area NDA is disposed adjacent to the display area DA,and the image IM is not displayed through the non-display area NDA. Abezel area of the display device DD is defined by the non-display areaNDA.

The non-display area NDA may surround the display area DA, but it shouldnot be limited thereto or thereby. That is, the display area DA and thenon-display area NDA may be designed to have shapes relative to eachother.

FIGS. 2A, 2B, 2C, and 2D are cross-sectional views showing the displaydevice DD according to an exemplary embodiment of the presentdisclosure. FIGS. 2A, 2B, 2C, and 2D show a cross-section defined by thesecond directional axis DR2 and the third directional axis DR3. FIGS.2A, 2B, 2C, and 2D simply show the display device DD to explain astacking relationship of a functional panel and/or functional members ofthe display device DD.

Referring to FIG. 2A, the display device DD includes a display panel DP,an input sensing circuit ISC, a reflection preventing member RPP, and awindow member WP. The input sensing circuit ISC may be directly disposedon the display panel DP. In the following descriptions, the term“directly disposed” means that a separate adhesive layer/adhesive memberis not disposed between two components.

The display panel DP and the input sensing circuit ISC directly disposedon the display panel DP define a display module DM. An optically clearadhesive member (OCA) is disposed between the display module DM and thereflection preventing member RPP and between the reflection preventingmember RPP and the window member WP.

The display panel DP generates an image, and the input sensing circuitISC acquires coordinate information about an external input, e.g., atouch event or a pressure applied thereto. Although not shownseparately, the display module DM according to the exemplary embodimentof the present disclosure may further include a protective memberdisposed on a lower surface of the display panel DP. The protectivemember and the display panel DP are coupled to each other by an adhesivemember. Display devices DD, which are shown in FIGS. 2B, 2C, and 2D anddescribed later, may also further include the protective member.

The display panel DP according to the exemplary embodiment of thepresent disclosure may be a light emitting type display panel. Forinstance, the display panel DP may be an organic light emitting displaypanel, a quantum dot light emitting display panel, or a micro LEDdisplay panel. A light emitting layer of the organic light emittingdisplay panel may include an organic light emitting material. A lightemitting layer of the quantum dot light emitting display panel mayinclude a quantum dot and a quantum rod. Hereinafter, the organic lightemitting display panel will be described as the display panel DP.

The reflection preventing member RPP reduces a reflectance of anexternal light incident from above the window member WP. The reflectionpreventing member RPP according to the exemplary embodiment of thepresent disclosure may include a retarder and a polarizer.

The reflection preventing member RPP according to the exemplaryembodiment of the present disclosure may include color filters.

The window member WP according to the exemplary embodiment of thepresent disclosure includes a base film WP-BS and a light blockingpattern WP-BZ. The base film WP-BS may include a glass and/or asynthetic resin. The base film WP-BS should not be limited to asingle-layer structure. The base film WP-BS may include two or morefilms coupled to each other by an adhesive member.

The light blocking pattern WP-BZ partially overlaps with the base filmWP-BS. The light blocking pattern WP-BZ is disposed on a rear surface ofthe base film WP-BS to define a bezel area of the display device DD,i.e., the non-display area NDA.

Hereinafter, the light blocking pattern WP-BZ and the base film WP-BSare not shown in FIGS. 2B, 2C, and 2D.

Referring to FIG. 2B, the display device DD includes a display panel DP,a reflection preventing member RPP, an input sensing circuit ISC, and awindow member WP.

The display panel DP and the reflection preventing member RPP may becoupled to each other by an optically clear adhesive member OCA. Thereflection preventing member RPP and the input sensing circuit ISC maybe coupled to each other by the optically clear adhesive member OCA. Theinput sensing circuit ISC and the window member WP may be coupled toeach other by the optically clear adhesive member OCA.

Referring to FIG. 2C, different from the stacking structure shown inFIG. 2B, a position of a reflection preventing member RPP and a positionof an input sensing circuit ISC are changed to each other.

The optically clear adhesive member OCA may have a predeterminedelasticity. When the pressure is applied from the outside, the inputsensing circuit ISC may be deformed in the third direction DR3 due tothe elasticity of the optically clear adhesive member OCA.

As shown in FIG. 2D, adhesive members may be omitted from the displaydevice DD, and a display panel DP, an input sensing circuit ISC, areflection preventing member RPP, and a window member WP may be formedthrough a consecutive process. According to another exemplary embodimentof the present disclosure, a stacking order of the input sensing circuitISC and the reflection preventing member RPP may be changed to eachother.

The input sensing circuit ISC may be a circuit that senses the user'stouch or the pressure applied thereto from the outside.

FIG. 3 is a plan view showing the display panel DP according to anexemplary embodiment of the present disclosure.

Referring to FIG. 3, the display panel DP includes a display area DP-DAand a non-display area DP-NDA when viewed in a plan view. In the presentexemplary embodiment, the non-display area DP-NDA may be defined alongan edge of the display area DP-DA. The display area DP-DA and thenon-display area DP-NDA of the display panel DP may respectivelycorrespond to the display area DA and the non-display area NDA of thedisplay device DD.

The display panel DP includes a scan driver 100, a data driver 200, aplurality of scan lines SL, a plurality of light emitting control linesECL, a plurality of data lines DL, a plurality of power lines PL, and aplurality of pixels PX. The pixels PX are arranged in the display areaDP-DA. Each of the pixels PX includes an organic light emitting diodeOLED (refer to FIG. 4) and a pixel circuit CC (refer to FIG. 4)connected to the organic light emitting diode OLED.

The scan driver 100 includes a scan driving unit and a light emittingcontrol driving unit.

The scan driving unit generates scan signals and sequentially appliesthe generated scan signals to the scan lines SL. The light emittingcontrol driving unit generates light emitting control signals andoutputs the generated light emitting control signals to the lightemitting control lines ECL.

According to another exemplary embodiment of the present disclosure, thescan driving unit and the light emitting control driving unit may beprovided in one circuit in the scan driver 100 without beingdistinguished from each other.

The scan driver 100 may include a plurality of thin film transistorsformed through the same process, e.g., a low temperature polycrystallinesilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO)process, as a driving circuit of the pixels PX.

The data driver 200 applies data signals to the data lines DL. The datasignals are analog voltages corresponding to grayscale values of imagedata.

In the exemplary embodiment of the present disclosure, the data driver200 is mounted on a printed circuit board FPCB, and the printed circuitboard FPCB is connected to pads disposed at one ends of the data linesDL. However, according to another exemplary embodiment, the data driver200 may be directly mounted on the display panel DP.

The scan lines SL extend in the first direction DR1 and are arranged inthe second direction DR2.

The light emitting control lines ECL extend in the first direction DR1and are arranged in the second direction DR2. That is, each of the lightemitting control lines ECL is arranged substantially parallel to acorresponding scan line among the scan lines SL.

The data lines DL extend in the second direction DR2 and are arranged inthe first direction DR1. The data lines DL apply the data signals tocorresponding pixels PX.

The power lines PL extend in the second direction DR2 and are arrangedin the first direction DR1. The power lines PL apply a first powervoltage ELVDD to corresponding pixels PX.

Each of the pixels PX is connected to a corresponding scan line amongthe scan lines SL, a corresponding light emitting control line among thelight emitting control lines ECL, a corresponding data line among thedata lines DL, and a corresponding power line among the power lines PL.

FIG. 4 is an equivalent circuit diagram showing the pixel PX accordingto an exemplary embodiment of the present disclosure. FIG. 5 is awaveform diagram showing the light emitting control signal Ei and thescan signals Si−1, Si, and Si+1, which are applied to the pixel PX ofFIG. 4. FIG. 4 shows the pixel PX connected to an i-th scan line SLi andan i-th light emitting control line ECLi. Here, the number i is anatural number.

Referring to FIG. 4, the pixel PX includes the organic light emittingdiode OLED and the pixel circuit CC. The pixel circuit CC includes aplurality of transistors T1 to T7 and a capacitor CP. The pixel circuitCC controls an amount of current flowing through the organic lightemitting diode OLED in response to the data signal.

The organic light emitting diode OLED emits a light at a predeterminedbrightness in response to the current provided from the pixel circuitCC. To this end, a level of the first power voltage ELVDD is set higherthan a level of a second power voltage ELVSS.

Each of the transistors T1 to T7 includes an input electrode (or asource electrode), an output electrode (or a drain electrode), and acontrol electrode (or a gate electrode). For the convenience ofexplanation, one electrode of the input electrode and the outputelectrode is referred to as “first electrode”, and the other electrodeof the input electrode and the output electrode is referred to as“second electrode”.

The first electrode of the first transistor T1 is connected to the firstpower voltage ELVDD via the fifth transistor T5, and the secondelectrode of the first transistor T1 is connected to an anode electrodeof the organic light emitting diode OLED via the sixth transistor T6.The first transistor T1 may be referred to as “driving transistor” inthe following descriptions.

The first transistor T1 controls the amount of the current flowingthrough the organic light emitting diode OLED in response to a voltageapplied to the control electrode.

The second transistor T2 is connected between the data line DL and thefirst electrode of the first transistor T1. The control electrode of thesecond transistor T2 is connected to the i-th scan line SLi. The secondtransistor T2 is turned on when an i-th scan signal Si is applied to thei-th scan line SLi to electrically connect the data line DL to the firstelectrode of the first transistor T1.

The third transistor T3 is connected between the second electrode andthe control electrode of the first transistor T1. The control electrodeof the third transistor T3 is connected to the i-th scan line SLi. Thethird transistor T3 is turned on when the i-th scan signal Si is appliedto the i-th scan line SLi to electrically connect the second electrodeand the control electrode of the first transistor T1. Accordingly, whenthe third transistor T3 is turned on, the first transistor T1 isconnected in a diode configuration.

The fourth transistor T4 is connected between a node ND and aninitialization voltage generator. The control electrode of the fourthtransistor T4 is connected to an (i−1)th scan line SLi−1. The fourthtransistor T4 is turned on when an (i−1)th scan signal Si−1 is appliedto the (i−1)th scan line SLi−1 to apply an initialization voltage Vintto the node ND.

The fifth transistor T5 is connected between the power line PL and thefirst electrode of the first transistor T1. The control electrode of thefifth transistor T5 is connected to the i-th light emitting control lineECLi.

The sixth transistor T6 is connected between the second electrode of thefirst transistor T1 and the anode electrode of the organic lightemitting diode OLED. The control electrode of the sixth transistor T6 isconnected to the i-th light emitting control line ECLi.

The seventh transistor T7 is connected between the initializationvoltage generator and the anode electrode of the organic light emittingdiode OLED. The control electrode of the seventh transistor T7 isconnected to an (i+1)th scan line SLi+1. The seventh transistor T7 isturned on when an (i+1)th scan signal Si+1 is applied to the (i+1)thscan line SLi+1 to apply the initialization voltage Vint to the anodeelectrode of the organic light emitting diode OLED.

The seventh transistor T7 improves a black display performance of thepixel PX. In detail, when the seventh transistor T7 is turned on, aparasitic capacitor of the organic light emitting diode OLED isdischarged. Accordingly, when a black brightness is realized, theorganic light emitting diode OLED does not emit the light even though aleakage current from the first transistor T1 occurs, and thus the blackdisplay performance of the pixel PX is improved.

In FIG. 4, the control electrode of the seventh transistor T7 isconnected to the (i+1)th scan line SLi+1, but it should be clear thatthe present disclosure is not limited to such exemplary embodiments.According to another exemplary embodiment of the present disclosure, thecontrol electrode of the seventh transistor T7 may be connected to thei-th scan line SLi or the (i−1)th scan line SLi−1.

In FIG. 4, the first to seventh transistors T1 to T7 of the pixel PXhave been described based on a PMOS, but they should not be limitedthereto or thereby. According to another exemplary embodiment of thepresent disclosure, the first to seventh transistors T1 to T7 of thepixel PX may be implemented by an NMOS. According to another exemplaryembodiment of the present disclosure, the first to seventh transistorsT1 to T7 of the pixel PX may be implemented by a combination of the PMOSand the NMOS.

The capacitor CP is disposed between the power line PL and the node ND.The capacitor CP is charged with a voltage corresponding to the datasignal. When the fifth and sixth transistors T5 and T6 are turned on,the amount of current flowing through the first transistor T1 isdetermined depending on the voltage charged in the capacitor CP.

In the present disclosure, the configuration of the pixel PX should notbe limited to the configuration shown in FIG. 4. According to anotherexemplary embodiment of the present disclosure, the pixel PX may beimplemented in various ways to allow the organic light emitting diodeOLED to emit the light.

Referring to FIG. 5, the light emitting control signal Ei has a highlevel E-HIGH or a low level E-LOW. Each of the scan signals SLi−1, SLi,and SLi+1 has a high level S-HIGH or a low level S-LOW.

When the light emitting control signal Ei has the high level E-HIGH, thefifth and sixth transistors T5 and T6 are turned off. When the fifthtransistor T5 is turned off, the power line PL and the first electrodeof the first transistor T1 are electrically blocked from each other.When the sixth transistor T6 is turned off, the second electrode of thefirst transistor T1 and the anode electrode of the organic lightemitting diode OLED are electrically blocked from each other.Accordingly, the organic light emitting diode OLED does not emit thelight during a period in which the light emitting control signal Eihaving the high level E-HIGH is applied to the i-th light emittingcontrol line ECLi.

Then, when the (i−1)th scan signal Si−1 applied to the (i−1)th scan lineSLi−1 has the low level S-LOW, the fourth transistor T4 is turned on.When the fourth transistor T4 is turned on, the initialization voltageVint is applied to the node ND.

When the i-th scan signal Si applied to the i-th scan line SLi has thelow level S-LOW, the second and third transistors T2 and T3 are turnedon.

When the second transistor T2 is turned on, the data signal is appliedto the first electrode of the first transistor T1. In this case, sincethe node ND is initialized to have the initialization voltage Vint, thefirst transistor T1 is turned on. When the first transistor T1 is turnedon, the voltage corresponding to the data signal is applied to the nodeND. In this case, the capacitor CP is charged with the voltagecorresponding to the data signal.

When the (i+1)th scan signal Si+1 applied to the (i+1)th scan line SLi+1has the low level S-LOW, the seventh transistor T7 is turned on.

When the seventh transistor T7 is turned on, the initialization voltageVint is applied to the anode electrode of the organic light emittingdiode OLED, and thus the parasitic capacitor of the organic lightemitting diode OLED is discharged.

When the light emitting control signal Ei applied to the light emittingcontrol line ECLi has the low level E-LOW, the fifth and sixthtransistors T5 and T6 are turned on. When the fifth transistor T5 isturned on, the first power voltage ELVDD is applied to the firstelectrode of the first transistor T1. When the sixth transistor T6 isturned on, the second electrode of the first transistor T1 and the anodeelectrode of the organic light emitting diode OLED are electricallyconnected to each other. Accordingly, the organic light emitting diodeOLED generates the light with the predetermined brightness in responseto the amount of the current applied thereto.

FIG. 6 is a cross-sectional view showing a portion of the pixel PX(refer to FIG. 4) according to an exemplary embodiment of the presentdisclosure. FIG. 6 shows the first and second transistors T1 and T2 as arepresentative example, but the structure of the first and secondtransistors T1 and T2 should not be limited thereto or thereby. In FIG.6, it seems that the second electrode ED2 of the first transistor T1directly makes contact with the anode electrode AE of the pixel PX, butthis is because FIG. 6 shows a cross-sectional shape. In the presentexemplary embodiment, as shown in FIG. 4, the first transistor T1 isconnected to the anode electrode AE of the pixel PX via the sixthtransistor T6, but it should not be limited thereto or thereby. That is,according to another exemplary embodiment of the present disclosure, thesecond electrode ED2 of the first transistor T1 may directly makecontact with the anode electrode AE of the pixel PX.

The display panel DP (refer to FIG. 3) includes a base layer BL, acircuit layer CL, a light emitting device layer ELL, and anencapsulation layer TFE.

The circuit layer CL includes a buffer layer BFL, gate insulating layersGI1 and GI2, an interlayer insulating layer ILD, a circuit insulatinglayer VIA, and the transistors T1 and T2.

The light emitting device layer ELL may include the organic lightemitting diode OLED and a pixel definition layer PDL.

The encapsulation layer TFE encapsulates the light emitting device layerELL to protect the light emitting device layer ELL from external oxygenor moisture.

The buffer layer BFL is disposed on one surface of the base layer BL.

The buffer layer BFL prevents or suppresses foreign substances in thebase layer BL from entering the pixel PX during a manufacturing process.In particular, the buffer layer BFL prevents or suppresses the foreignsubstances from entering active portions ACL of the transistors T1 andT2 of the pixel PX.

The foreign substances may inflow from the outside or may be generatedwhen the base layer BL is pyrolyzed. The foreign substances may be gasor sodium discharged from the base layer BL. In addition, the bufferlayer BFL blocks moisture from entering the pixel PX from the outside.

The active portions ACL of the transistors T1 and T2 are disposed on thebuffer layer BFL. Each of the active portions ACL includes polysiliconor amorphous silicon. As another way, the active portions ACL mayinclude a metal oxide semiconductor.

The active portions ACL include a channel area that serves as a passagethrough which electrons or holes move, a first ion doping area, and asecond ion doping area disposed such that the channel area is disposedbetween the first ion doping area and the second ion doping area.

A first gate insulating layer GI1 is disposed above the buffer layer BFLto cover the active portions ACL. The first gate insulating layer GI1includes an organic layer and/or an inorganic layer. The first gateinsulating layer GI1 includes a plurality of inorganic thin film layers.The inorganic thin film layers include a silicon nitride layer and asilicon oxide layer.

The control electrodes GE1 of the transistors T1 and T2 are disposed onthe first gate insulating layer GI1. The control electrode GE1 of thefirst transistor T1 may be one of two electrodes forming the capacitorCP. At least some of the scan lines SL (refer to FIG. 3) and the lightemitting control lines ECL (refer to FIG. 3) are disposed on the firstgate insulating layer GI1.

A second gate insulating layer GI2 is disposed on the first gateinsulating layer GI1 to cover the control electrodes GE1. The secondgate insulating layer GI2 includes an organic layer and/or an inorganiclayer. The second gate insulating layer GI2 includes a plurality ofinorganic thin film layers. The inorganic thin film layers include asilicon nitride layer and a silicon oxide layer.

The other electrode GE2 of the two electrodes forming the capacitor CP(refer to FIG. 4) is disposed on the second gate insulating layer GI2.That is, the control electrode GE1 disposed on the first gate insulatinglayer GI1 overlaps with the electrode GE2 disposed on the second gateinsulating layer GI2 to form the capacitor CP shown in FIG. 4. However,positions of the electrodes forming the capacitor CP should not belimited thereto or thereby.

The interlayer insulating layer ILD is disposed on the second gateinsulating layer GI2 to cover the electrode GE2. The interlayerinsulating layer ILD includes an organic layer and/or an inorganiclayer. The interlayer insulating layer ILD includes a plurality ofinorganic thin film layers. The inorganic thin film layers include asilicon nitride layer and a silicon oxide layer.

At least some portions of the data line DL (refer to FIG. 3) and thepower line PL (refer to FIG. 3) are disposed on the interlayerinsulating layer ILD. The first electrodes ED1 and the second electrodesED2 of the transistors T1 and T2 are disposed on the interlayerinsulating layer ILD.

The first electrodes ED1 and the second electrodes ED2 are connected tocorresponding active portions ACL through thru-holes defined through thegate insulating layers GI1 and GI2 and the interlayer insulating layerILD.

The circuit insulating layer VIA is disposed on the interlayerinsulating layer ILD to cover the first electrodes ED1 and the secondelectrodes ED2. The circuit insulating layer VIA includes an organiclayer and/or an inorganic layer. The circuit insulating layer VIAprovides a flat surface.

The pixel definition layer PDL and the organic light emitting diode OLEDare disposed on the circuit insulating layer VIA.

The organic light emitting diode OLED may include an anode electrode AE,a hole control layer HL, a light emitting layer EML, an electron controllayer EL, and a cathode electrode CE.

FIG. 7A is a plan view showing the input sensing circuit ISC accordingto an exemplary embodiment of the present disclosure. FIG. 7B is anenlarged plan view showing a portion AA of FIG. 7A. FIG. 7C is anenlarged plan view showing a portion BB of FIG. 7A. FIG. 8A is across-sectional view taken along a sectional line I-I′ of FIG. 7C. FIG.8B is a cross-sectional view taken along a sectional line II-IF of FIG.7C.

The input sensing circuit ISC may include an input sensing area SAdefined therein to sense the external input.

The input sensing circuit ISC may include first sensor groups IEG1,second sensor groups IEG2, first connection portions CP1, secondconnection portions CP2, first signal lines SSL1, second signal linesSSL2, a first measuring line MSL1, a second measuring line MSL2, signalpads PD-S1 and PD-S2, sensing pads PD-R1 and PD-R2, a printed circuitboard FPCB-T, and an input sensing driver 300. In the exemplaryembodiment of the present disclosure, the input sensing circuit ISC mayfurther include a base film BF, a first insulating layer IS1, or asecond insulating layer IS2.

Each of the first sensor groups IEG1 may extend in the first directionDR1, and the first sensor groups IEG1 may be arranged in the seconddirection DR2. Each of the first sensor groups IEG1 may include aplurality of first sensors IE1. The first sensors 1E1 may be arranged inthe first direction DR1. As an example, the first sensor IE1 may be anRx sensor.

Each of the second sensor groups IEG2 may extend in the second directionDR2, and the second sensor groups IEG2 may be arranged in the firstdirection DR1. Each of the second sensor groups IEG2 may include aplurality of second sensors IE2. The second sensors IE2 may be arrangedin the second direction DR2. As an example, the second sensor IE2 may bea Tx sensor.

A length of the first sensor group IEG1 in the first direction DR1 maybe shorter than a length of the second sensor group IEG2 in the seconddirection DR2.

In the exemplary embodiment of the present disclosure, the first sensorsIE1 and the second sensors IE2 may include indium tin oxide (ITO) orindium zinc oxide (IZO), however, they should not be limited thereto orthereby. That is, the first sensors IE1 and the second sensors IE2 mayinclude molybdenum (Mo).

In the exemplary embodiment of the present disclosure, each of the firstsensors IE1 may be capacitively coupled to the second sensors IE2adjacent thereto among the second sensors IE2 to form a capacitance. Theinput sensing circuit ISC may sense a variation in capacitance formedbetween the first sensors 1E1 and the second sensors IE2 to determinewhether the external input is applied thereto.

Dummy patterns DMP may be disposed between the first sensors IE1 and thesecond sensors IE2. The dummy patterns DMP may be disposed spaced apartfrom the first sensors IE1 and the second sensors IE2. The dummypatterns DMP may be insulated from the first sensors IE1 and the secondsensors IE2. When the dummy patterns DMP are disposed, a boundary areabetween the first sensors IE1 and the second sensors IE2 may beinvisible to the user.

In the exemplary embodiment of the present disclosure, the dummypatterns DMP may include indium tin oxide or indium zinc oxide.

In the exemplary embodiment of the present disclosure, each of the firstsensors IE1 and the second sensors IE2 may be defined as one of a firstnormal sensor NIE1 and a second normal sensor NIE2 depending on theirarea.

Among the first sensors IE1 and the second sensors IE2, sensors having alozenge shape and a first area may be defined as the first normal sensorNIE1.

Among the first sensors IE1 and the second sensors IE2, sensors havingan isosceles triangular shape and a second area corresponding to a halfof the first area may be defined as the second normal sensor NIE2.

The first signal lines SSL1 may be electrically connected to the firstsensor groups IEG1, respectively. In the exemplary embodiment of thepresent disclosure, the first signal lines SSL1 may be connected to thefirst sensor groups IEG1 in a single routing structure.

The second signal lines SSL2 may be electrically connected to the secondsensor groups IEG2, respectively. In the exemplary embodiment of thepresent disclosure, the second signal lines SSL2 may be connected to thesecond sensor groups IEG2 in a double routing structure.

The first measuring line MSL1 and the second measuring line MSL2 may beconnected to at least one of the first sensor groups IEG1. The firstmeasuring line MSL1 and the second measuring line MSL2 may be connectedto the input sensing driver 300.

The input sensing driver 300 may sense a change in a resistance value ofthe first measuring line MSL1, the second measuring line MSL2, the firstsensors IE1 of the first sensor group IEG1 connected to the first andsecond measuring lines MSL1 and MSL2, and the first connection portionsCP1.

When the pressure is applied from the outside, the resistance value ofthe first sensors IE1 is changed due to the pressure applied to thefirst sensors IE1, and it is possible to sense whether the pressure isexternally applied by measuring the change in the resistance value.

The first signal pads PD-S1 may be connected to the first signal linesSSL1. The second signal pads PD-S2 may be connected to the second signallines SSL2.

The first sensing pads PD-S1 may be connected to the first measuringline MSL1, and the second sensing pads PD-S2 may be connected to thesecond measuring line MSL2.

The printed circuit board FPCB-T may be electrically connected to thesignal pads PD-S1 and PD-S2 and the sensing pads PD-R1 and PD-R2.

The input sensing driver 300 may be mounted on the printed circuit boardFPCB-T. The input sensing driver 300 may transmit, receive, or calculateelectrical signals used to determine whether the user's touch occurs inthe input sensing area SA and whether the pressure is applied to theinput sensing area SA.

A time period in which the input sensing driver 300 determines whetherthe user's touch occurs may be different from a time period in which theinput sensing driver 300 determines whether the pressure is applied. Forexample, the input sensing driver 300 determines whether the pressure isapplied during a first period and the input sensing driver 300determines whether the user's touch occurs during a second period,wherein the first period and the second period are different from eachother. This is because when the signal used to determine whether theuser's touch occurs and the signal used to determine whether thepressure is applied are substantially simultaneously applied, one signalof the signals exerts influence on the other signal, and the inputsensing driver 300 may not make an accurate determination.

The portion AA of FIG. 7A, which is shown in FIG. 7B, is defined as aunit area AA required to sense the external input by the input sensingcircuit ISC. A left first sensor IE1-1, a right first sensor 1E1-2, anupper second sensor 1E2-1, and a lower second sensor 1E2-2 are arrangedin the unit area AA.

The first sensors IE1-1 and 1E1-2 and the second sensor 1E2-1 and 1E2-2form the capacitance in the unit area AA.

The left first sensor 1E1-1 and the right first sensor 1E1-2 areelectrically connected to each other by the first connection portionCP1. The left first sensor 1E1-1, the right first sensor 1E1-2, and thefirst connection portion CP1 may be disposed on the same layer.

The upper second sensor 1E2-1 and the lower second sensor 1E2-2 areelectrically connected to each other by the second connection portionCP2. At least a portion of the second connection portion CP2 may bedisposed on a layer different from the upper second sensor 1E2-1 and thelower second sensor 1E2-2.

Although not shown separately, an antistatic pattern may be connected toeach of the upper second sensor 1E2-1 and the lower second sensor 1E2-2.The antistatic pattern may induce static electricity to its vertex toprevent or protect the second connection portion CP2 from beingdisconnected.

Referring to FIGS. 8A and 8B, the first sensors IE1-1 and 1E1-2, thesecond sensors 1E2-1 and 1E2-2, and the first connection portions CP1may be disposed on the base film BF.

The first insulating layer IS1 may be disposed on the base film BF andmay cover the first sensors 1E1-1 and 1E1-2, the second sensors 1E2-1and 1E2-2, and the first connection portions CP1. The first insulatinglayer IS1 may be provided with first contact holes CH1 definedtherethrough.

At least a portion of each of the second connection portions CP2 may bedisposed on the first insulating layer IS1. The second connectionportions CP2 may be connected to the second sensors 1E2-1 and 1E2-2through the first contact holes CH1.

The second insulating layer IS2 may be disposed on the first insulatinglayer IS1 to cover the second connection portions CP2.

Each of the first insulating layer IS1 and the second insulating layerIS2 may include an organic material or an inorganic material.

According to another exemplary embodiment of the present disclosure, thebase film BF shown in FIGS. 8A and 8B may be replaced with theencapsulation layer TFE (refer to FIG. 6) of the display panel DP.

FIG. 9 is an enlarged plan view showing a portion EE of FIG. 7A.

Referring to FIG. 9, a left first sensor IE1 a-1 may include a bodyportion BD, a first junction portion JC1, and a second junction portionJC2.

The body portion BD shown in FIG. 9 may have substantially the sameshape as the left first sensor IE1-1 shown in FIG. 7B.

The first junction portion JC1 may be protruded from the body portion BDin a direction substantially parallel to the first direction DR1. Thefirst junction portion JC1 may be connected to the first signal lineSSL1.

The second junction portion JC2 may be protruded from the body portionBD in a direction substantially parallel to the first direction DR1. Thesecond junction portion JC2 may be connected to the first measuring lineMSL1.

A length L1 (hereinafter, referred to as a “first length”) obtained bymeasuring the first junction portion JC1 in the first direction DR1 maybe different from a length L2 (hereinafter, referred to as a “secondlength”) obtained by measuring the second junction portion JC2 in thefirst direction DR1. In detail, the first length L1 may be shorter thanthe second length L2.

Descriptions on the other components of the present exemplary embodimentare substantially the same as those of FIG. 7B, and thus details thereofwill be omitted.

FIG. 10 is an enlarged plan view showing a portion FF of FIG. 7A.

Referring to FIG. 10, a right first sensor IE1 a-2 may include a bodyportion BD and a third junction portion JC3.

The third junction portion JC3 may be protruded from the body portion BDin a direction substantially parallel to the first direction DR1. Thethird junction portion JC3 may be connected to the second measuring lineMSL2.

Descriptions on the other components of the present exemplary embodimentare substantially the same as those of FIG. 7B, and thus details thereofwill be omitted.

FIG. 11 is an enlarged plan view showing another example of a portion EEof FIG. 7A.

Referring to FIG. 11, a left first sensor IE1 b-1 may include a bodyportion BD, a first junction portion JC1-1, and a second junctionportion JC2-1.

A length L3 (hereinafter, referred to as a “third length”) obtained bymeasuring the first junction portion JC1-1 in the second direction DR2may be different from a length L4 (hereinafter, referred to as a “fourthlength”) obtained by measuring the second junction portion JC2-1 in thesecond direction DR2. In detail, the third length L3 may be equal to orgreater than the fourth length L4 and equal to or smaller than fourtimes the fourth length L4. When the third length L3 is smaller than thefourth length L4, a contact area between the first junction portionJC1-1 and the first signal line SSL1 may decrease, and as a result, asensitivity of the input sensing circuit ISC may be lowered. When thethird length L3 exceeds four times the fourth length L4, a contact areabetween the second junction portion JC2-1 and the first measuring lineMSL1 may decrease, and as a result, a resistance value of a closed loopformed by the first measuring line MSL1, the first sensors IE1, and thesecond measuring line MSL2 may become too high.

FIG. 12A is an enlarged plan view showing another example of a portionEE of FIG. 7A. FIG. 12B is a cross-sectional view taken along asectional line of FIG. 12A.

Referring to FIGS. 12A and 12B, a left first sensor IE1 c-1 may bedisposed on the base film BF. The left first sensor IE1 c-1 may includea body portion BD and a first junction portion JC1-2.

The first signal line SSL1 may be disposed on the first junction portionJC1-2.

The first insulating layer IS1 may be disposed on the base film BF. Thefirst insulating layer IS1 may cover at least a portion of the firstjunction portion JC1-2 and the body portion BD. The first insulatinglayer IS1 may not cover the first signal line SSL1. The first insulatinglayer IS1 may be provided with a second contact hole CH2 definedtherethrough.

A second junction portion JC2-2 may be disposed on the first insulatinglayer IS1. The second junction portion JC2-2 may overlap with the firstjunction portion JC1-2. The second junction portion JC2-2 may beconnected to the left first sensor IE1 c-1 through the second contacthole CH2.

The first measuring line MSL1 may be disposed on the second junctionportion JC2-2.

The second insulating layer IS2 may be disposed on the first insulatinglayer IS1 and may cover at least a portion of the second junctionportion JC2-2. The second insulating layer IS2 may not cover the firstmeasuring line MSL1.

FIG. 13 is a plan view showing an input sensing circuit ISC-1 accordingto an exemplary embodiment of the present disclosure.

The input sensing circuit ISC-1 may include first sensor groups IEG1,second sensor groups IEG2, first connection portions CP1, secondconnection portions CP2, first signal lines SSL1, second signal linesSSL2, a first measuring line MSL1, a second measuring line MSL2, a thirdmeasuring line MSL3, a fourth measuring line MSL4, signal pads PD-S1 andPD-S2, sensing pads PD-R1, PD-R2, PD-R3, and PD-R4, a printed circuitboard FPCB-T, and input sensing driver 300.

The input sensing circuit ISC-1 shown in FIG. 13 may further include thethird measuring line MSL3, the fourth measuring line MSL4, the thirdsensing pad PD-R3, and the fourth sensing pad PD-R4 when compared withthe input sensing circuit ISC shown in FIG. 7A.

A connection structure between one first sensor group IEG1, the thirdmeasuring line MSL3, the fourth measuring line MSL4, the third sensingpad PD-R3, and the fourth sensing pad PD-R4 may be substantially thesame as a connection structure between another first sensor group IEG1adjacent to the one first sensor group IEG1, the first measuring lineMSL1, the second measuring line MSL2, the first sensing pad PD-R1, andthe second sensing pad PD-R2.

The input sensing driver 300 may compare a resistance change value(hereinafter, referred to as a “first resistance change value”) of thefirst sensor group IEG1, which is measured using the first measuringline MSL1, the second measuring line MSL2, the first sensing pad PD-R1,and the second sensing pad PD-R2 with a resistance change value(hereinafter, referred to as a “second resistance change value”) of thefirst sensor group IEG1, which is measured using the third measuringline MSL3, the fourth measuring line MSL4, the third sensing pad PD-R3,and the fourth sensing pad PD-R4.

When the first resistance change value is substantially equal to thesecond resistance change value, the input sensing driver 300 maydetermine that the resistance change of the first sensor group IEG1 isdue to an external temperature change and the external pressure is notapplied.

When a difference between the first resistance change value and thesecond resistance change value is equal to or greater than apredetermined value (e.g., about 5%), the input sensing driver 300 maydetermine that the resistance change of the first sensor group IEG1 isdue to the pressure applied from the outside.

FIG. 14 is a plan view showing an input sensing circuit ISC-2 accordingto an exemplary embodiment of the present disclosure. FIG. 15 is anenlarged plan view showing a portion EE-1 of FIG. 14. FIG. 16 is anenlarged plan view showing a portion FF-1 of FIG. 14.

Referring to FIG. 15, a left first sensor IE1 d-1 may include an activesensor portion SNT, a floating portion FLR, a first junction portionJC1-3, and a second junction portion JC2-3.

Each of a right first sensor IE1 d-2, an upper second sensor IE2 d-1,and a lower second sensor IE2 d-2 may include the active sensor portionSNT and the floating portion FLR.

The floating portion FLR may be disposed to be spaced apart from theactive sensor portion SNT. The floating portion FLR may be in anelectrically floating state.

Each of the active sensor portions SNT may be electrically connected toa corresponding another active sensor portion SNT and may transmit andreceive electrical signals to sense the user's touch or the externalpressure.

The first junction portion JC1-3 may be protruded from one end of theactive sensor portion SNT in a direction substantially parallel to thefirst direction DR1. The first junction portion JC1-3 may be connectedto the first signal line SSL1.

The second junction portion JC2-3 may be protruded from the other end ofthe active sensor portion SNT in the direction substantially parallel tothe first direction DR1. The second junction portion JC2-3 may beconnected to the first measuring line MSL1.

Referring to FIG. 16, a right first sensor IE1 e-2 may include an activesensor portion SNT, a floating portion FLR, and a third junction portionJC3-3.

Each of a left first sensor IE1 e-1, an upper second sensor IE2 d-1, anda lower second sensor IE2 d-2 may include the active sensor portion SNTand the floating portion FLR.

The third junction portion JC3-3 may be protruded from one end of theactive sensor portion SNT in a direction substantially parallel to thefirst direction DR1. The third junction portion JC3-3 may be connectedto the first measuring line MSL1.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A display module comprising: a display panel; andan input sensing circuit disposed on the display panel, the inputsensing circuit comprising: a first sensor group comprising a pluralityof first sensors arranged in a first direction; a plurality of firstconnection portions electrically connecting two adjacent first sensorsof the plurality of first sensors, respectively; a second sensor groupcomprising a plurality of second sensors arranged in a second directioncrossing the first direction; a plurality of second connection portionselectrically connecting two adjacent second sensors of the plurality ofsecond sensors, respectively; a first signal line electrically connectedto one first sensor of the plurality of first sensors; a first measuringline electrically connected to the one first sensor among the pluralityof first sensors and spaced apart from the first signal line; and asecond measuring line electrically connected to another first sensoramong the plurality of first sensors.
 2. The display module of claim 1,wherein the one first sensor among the plurality of first sensorscomprises: a body portion; a first junction portion protruded from thebody portion in a direction substantially parallel to the firstdirection and connected to the first signal line; and a second junctionportion protruded from the body portion in the direction substantiallyparallel to the first direction and connected to the first measuringline.
 3. The display module of claim 2, wherein a first length of thefirst junction portion in the first direction is different from a secondlength of the second junction portion in the first direction.
 4. Thedisplay module of claim 3, wherein the second length is longer than thefirst length.
 5. The display module of claim 2, wherein a third lengthof the first junction portion in the second direction is equal to orgreater than a fourth length of the second junction portion in thesecond direction and equal to or smaller than four times the fourthlength.
 6. The display module of claim 1, wherein the input sensingcircuit further comprises an insulating layer that covers the pluralityof first sensors, the plurality of second sensors, and the firstconnection portions, at least a portion of each of the second connectionportions is disposed on the insulating layer, and the one first sensorof the plurality of first sensors comprises a body portion and a firstjunction portion protruded from the body portion in the first directionand connected to the first signal line.
 7. The display module of claim6, wherein the input sensing circuit further comprises a second junctionportion disposed on the insulating layer, overlapped with the firstjunction portion, and connected to the one first sensor of the pluralityof first sensors and the first measuring line.
 8. The display module ofclaim 7, wherein a plurality of first contact holes and a second contacthole are defined through the insulating layer, the second connectionportions are connected to the plurality of second sensors through thefirst contact holes, and the second junction portion is connected to theone first sensor of the plurality of first sensors through the secondcontact hole.
 9. The display module of claim 1, wherein the inputsensing circuit further comprises a second signal line electricallyconnected to one second sensor among the plurality of second sensors.10. The display module of claim 9, wherein the input sensing circuitfurther comprises an input sensing driver electrically connected to thefirst signal line, the second signal line, the first measuring line, andthe second measuring line.
 11. The display module of claim 10, whereinthe input sensing driver is configured to sense a resistance changevalue of the first measuring line, the plurality of first sensors, andthe second measuring line during a first period.
 12. The display moduleof claim 11, wherein the input sensing driver is configured to sense acapacitance value formed by the plurality of first sensors and theplurality of second sensors during a second period, the second periodbeing different from the first period.
 13. The display module of claim10, wherein the first sensor group comprises a plurality of the firstsensor groups, and the input sensing driver is configured to compare aresistance change value of one first sensor group among the plurality offirst sensor groups with a resistance change value of another firstsensor group among the plurality of first sensor groups, the one firstsensor group and the another first sensor group being adjacent to eachother.
 14. The display module of claim 1, further comprising an adhesivemember disposed between the display panel and the input sensing circuit,the adhesive member having a predetermined elasticity.
 15. The displaymodule of claim 1, wherein the one first sensor among the plurality offirst sensors is disposed at one distal end of the first sensor group inthe first direction, and the another first sensor among the plurality offirst sensors is disposed at an opposing distal end of the first sensorgroup in the first direction.
 16. An input sensing circuit comprising: abase layer; a plurality of first sensors disposed on the base layer andarranged in a first direction; a plurality of first connection portionsdisposed on the base layer and electrically connecting two adjacentfirst sensors of the plurality of first sensors, respectively; aplurality of second sensors disposed on the base layer and arranged in asecond direction crossing the first direction; an insulating layerdisposed on the base layer, covering the plurality of first sensors, thefirst connection portions, and the plurality of second sensors, theinsulating layer comprising a plurality of contact holes definedtherethrough; a plurality of second connection portions disposed on theinsulating layer and electrically connecting two adjacent second sensorsof the plurality of second sensors through at least one of the contactholes, respectively; a first signal line disposed on the base layer andelectrically connected to one first sensor of the plurality of firstsensors; a first measuring line disposed on the base layer andelectrically connected to the one first sensor among the plurality offirst sensors; and a second measuring line disposed on the base layerand electrically connected to another first sensor among the pluralityof first sensors.
 17. The input sensing circuit of claim 16, wherein theone first sensor among the plurality of first sensors comprises: a bodyportion; a first junction portion protruded from the body portion in adirection substantially parallel to the first direction and connected tothe first signal line; and a second junction portion protruded from thebody portion in the direction substantially parallel to the firstdirection and connected to the first measuring line.
 18. The inputsensing circuit of claim 17, wherein a first length of the firstjunction portion in the first direction is smaller than a second lengthof the second junction portion in the first direction.
 19. The inputsensing circuit of claim 18, wherein a third length of the firstjunction portion in the second direction is equal to or greater than afourth length of the second junction portion in the second direction andequal to or smaller than four times the fourth length.
 20. The inputsensing circuit of claim 16, wherein the one first sensor among theplurality of first sensors comprises a body portion and a first junctionportion protruded from the body portion in a direction substantiallyparallel to the first direction and connected to the first signal line.21. The input sensing circuit of claim 20, further comprising a secondjunction portion disposed on the insulating layer, overlapped with thefirst junction portion, connected to the one first sensor among theplurality of first sensors through other contact holes of the contactholes, and connected to the first measuring line.
 22. The input sensingcircuit of claim 16, further comprising a second signal line disposed onthe base layer and electrically connected to one second sensor among theplurality of second sensors.
 23. The input sensing circuit of claim 22,further comprising an input sensing driver electrically connected to thefirst signal line, the second signal line, the first measuring line, andthe second measuring line.
 24. The input sensing circuit of claim 23,wherein the input sensing driver is configured to sense a resistancechange value of the first measuring line, the plurality of firstsensors, and the second measuring line during a first period.
 25. Theinput sensing circuit of claim 24, wherein the input sensing driver isconfigured to sense a capacitance value formed by the plurality of firstsensors and the plurality of second sensors during a second perioddifferent from the first period.
 26. The input sensing circuit of claim23, wherein the plurality of first sensors are part of a first sensorgroup, the first sensor group comprises a plurality of the first sensorgroups, and the input sensing driver is configured to compare aresistance change value of one first sensor group among the plurality offirst sensor groups with a resistance change value of another firstsensor group among the plurality of first sensor groups, the one firstsensor group and the another first sensor group being adjacent to eachother.